| 線別 | 廠牌 | 機型 | 精度 (Chip) | 每小時產能 |
|---|---|---|---|---|
| 1 | Hitachi/Yamaha | Σ-G5S+Σ-G5+YVL88II | 01005 (0.4mm ×0.2 mm) | 123,000 CPH |
| 2 | Hitachi/Yamaha | Σ-G5+YV100II | 01005 (0.4mm ×0.2 mm) | 74,000 CPH |
| 3 | Yamaha | Σ-G5+YV100XG | 01005 (0.4mm ×0.2 mm) | 74,000 CPH |
三條靈活SMD產能配置，依客戶產品零件數或精度做最佳搭配。
SMD線皆配備全自動印刷機，提高製程良率。
配備3台 TRI AOI產品全數經由AOI全檢，提高產品良率。
全廠區靜電防護，保障產品不受靜電危害。
LINE 1 : 送板機→吸板機→自動印刷機→SPI→高速機→高速機→泛用機→20區迴焊爐→收板機→AOI
LINE 2 : 送板機→吸板機→自動印刷機→檢查錫膏CCD放大鏡→高速機→中速機→20區迴焊爐→收板機→AOI
LINE 3 : 送板機→吸板機→自動印刷機→檢查錫膏CCD放大鏡→中速機→高速機→16區迴焊爐→AOI
LINE1 製程能力
| Stencil Size Range (鋼板尺寸) | L 650 mm × W 550 mm |
| Min. IC Pitch (IC最小腳距) | 0.30 mm |
| Max. PCB Size (PCB最大尺寸) | L 500 mm × W 250 mm |
| Min. Chip Size (Chip 最小尺寸) | 01005(0.4mm ×0.2 mm) |
| Max. Comp. Size (元件最大尺寸) | 72 mm × 72 mm Connector : 150mm x 26mm |
| Min. BGA Ball Pitch (BGA最小球距尺寸) | 0.80 mm (Min) |
| Min. BGA Ball Diameter (BGA最小球徑尺寸) | 0.40 mm (Min) |
| Min. QFP Lead Pitch (QFP最小腳距尺寸) | 0.38 mm (Min) |
| Frequency of Stencil Cleaning (鋼板擦拭頻率) | 1 time / 10 Pieces |
| Accuracy for HITACHI Σ-G5S (貼片精度) | 03015 to 0603 Chip : 30μm(3σ) ; IC : 15μm(3σ) |
| Accuracy for HITACHI Σ-G5 (貼片精度) | 0201 / 01005 Chip : 40μm(3σ) ; IC : 30μm(3σ) |
| Accuracy for YVL88II (貼片精度) | Within +/-0.08mm/chip ; +/-0.04mm/QFP |
LINE2 製程能力
| Stencil Size Range (鋼板尺寸) | L 650 mm × W 550 mm |
| Min. IC Pitch (IC最小腳距) | 0.30 mm |
| Max. PCB Size (PCB最大尺寸) | L 610 mm × W 300 mm |
| Min. Chip Size (Chip 最小尺寸) | 01005(0.4mm ×0.2 mm) |
| Max. Comp. Size (元件最大尺寸) | 44 mm × 44 mm |
| Min. BGA Ball Pitch (BGA最小球距尺寸) | 0.25 mm (Min) |
| Min. BGA Ball Diameter (BGA最小球徑尺寸) | 0.13 mm (Min) |
| Min. QFP Lead Pitch (QFP最小腳距尺寸) | 0.30 mm (Min) |
| Frequency of Stencil Cleaning (鋼板擦拭頻率) | 1 time / 10 Pieces |
| Accuracy for HITACHI Σ-G5 (貼片精度) | 0201 / 01005 Chip : 40μm(3σ) ; IC : 30μm(3σ) |
| Accuracy for YVL100II (貼片精度) | Within +/-0.1mm/chip ; +/-0.08mm/QFP |
LINE3 製程能力
| Stencil Size Range (鋼板尺寸) | L 650 mm × W 550 mm |
| Min. IC Pitch (IC最小腳距) | 0.30 mm |
| Max. PCB Size (PCB最大尺寸) | L460xW440mm |
| Min. Chip Size (Chip 最小尺寸) | 01005(0.4mm ×0.2 mm) |
| Max. Camera Size (鏡頭最大尺寸) | 44 mm × 44 mm |
| Min. BGA Ball Pitch (BGA最小球距尺寸) | 0.13 mm (Min) |
| Min. BGA Ball Diameter (BGA最小球徑尺寸) | 0.30 mm (Min) |
| Min. QFP Lead Pitch (QFP最小腳距尺寸) | 0.38 mm (Min) |
| Frequency of Stencil Cleaning (鋼板擦拭頻率) | 1 time / 10 Pieces |
| Accuracy for HITACHI Σ-G5 (貼片精度) | 0201 / 01005 Chip : 40μm(3σ) ; IC : 30μm(3σ) |
| Accuracy for YV100XG (貼片精度) | Within (μ＋3σ）：+/-0.05mm/CHIP，+/-0.05mm/QFP |
