| 線別 | 廠牌 | 機型 | 精度 (Chip) | 每小時產能 |
|---|---|---|---|---|
| 1 | Yamaha | Σ-G5S2+Σ-G5S2+Σ-G5S2 | 01005 | 234,500 Chip |
| 2 | Yamaha/Hitachi | Σ-G5S + Σ-G5 | 01005 | 121,500 Chip |
| 3 | Hitachi | Σ-G5 + Σ-G5 | 01005 | 121,500 Chip |
The three flexible lines of SMD capacity configuration that best suits customers’ specified product component number or precision.
All lines are equipped with an EKRA automatic printer to improve the process yield.
Three units of TRI AO products all undergo AOI testing to improve the product yield.
Equipped with an American IGS nitrogen generator, which can supply nitrogen to the reflow furnace at all times.
Whole area is entirely protected by static electricity to ensure products are free from static electricity damage.
LINE 1 : Board feeding → Board suction → Automatic printing → SPI → High-speed → High-speed → High-speed (also TRAY) → 20-zone reflow oven → Board collecting → AOI
LINE 2 :Board feeding → Board suction → Automatic printing → SPI → High-speed → High-speed (also TRAY machine) → 20-zone reflow oven → Board collecting → AOI
LINE 3 :Board feeding → Board suction → Automatic printing → CCD solder paste inspection machine→medium speed machine→reflow oven in area 16→AOI
LINE1 Process Capabilities
| Stencil Size Range | L 750 mm × W 750 mm(MAX) |
| Min. IC Pitch | 0.30mm |
| Max. PCB Size | L 610 mm × W 510 mm |
| Min. Chip Size | 0201(0.25 mm × 0.125 mm) |
| Max. Comp. Size | 72 mm × 72 mm, Connector : 150mm x 26mm |
| Min. BGA Ball Pitch | 0.20 mm (Min) |
| Min. BGA Ball Diameter | 0.13 mm (Min) |
| Min. QFP Lead Pitch | 0.25 mm (Min) |
| Frequency of Stencil Cleaning | 1 time / 10 Pieces |
| Accuracy for YAMAHA Σ-G5S2 | 0201 to 008004 Chip : 25μm(3σ) ; IC : 15μm(3σ) |
| Accuracy for YAMAHA Σ-G5S2 | 0201 to 008004 Chip : 25μm(3σ) ; IC : 15μm(3σ) |
| Accuracy for YAMAHA Σ-G5S2 | 0201 to 008004 Chip : 25μm(3σ) ; IC : 15μm(3σ) |
LINE2 Process Capabilities
| Stencil Size Range | L 737 mm × W 737 mm(MAX) |
| Min. IC Pitch | 0.30mm |
| Max. PCB Size | L 610 mm × W 510 mm |
| Min. Chip Size | 03015(0.3 mm × 0.15 mm) |
| Max. Comp. Size | 72 mm × 72 mm, Connector : 100mm x 26mm |
| Min. BGA Ball Pitch | 0.25 mm (Min) |
| Min. BGA Ball Diameter | 0.13 mm (Min) |
| Min. QFP Lead Pitch | 0.30 mm (Min) |
| Frequency of Stencil Cleaning | 1 time / 10 Pieces |
| Accuracy for YAMAHA Σ-G5S | 03015 to 009005 Chip : 30μm(3σ) ; IC : 15μm(3σ) |
| Accuracy for HITACHI Σ-G5 | 01005 to 0402 Chip : 30μm(3σ) ; IC : 15μm(3σ) |
LINE3 Process Capabilities
| Stencil Size Range | L 737 mm × W 737 mm |
| Min. IC Pitch | 0.30mm |
| Max. PCB Size | L 610 mm × W 510 mm |
| Min. Chip Size | 03015(0.3 mm × 0.15 mm) |
| Max. Comp. Size | 72 mm × 72 mm, Connector : 100mm x 26mm |
| Min. BGA Ball Pitch | 0.25 mm (Min) |
| Min. BGA Ball Diameter | 0.13 mm (Min) |
| Min. QFP Lead Pitch | 0.30 mm (Min) |
| Frequency of Stencil Cleaning | 1 time / 10 Pieces |
| Accuracy for HITACHI Σ-G5 | 01005 to 0402 Chip : 30μm(3σ) ; IC : 15μm(3σ) |
| Accuracy for HITACHI Σ-G5 | 01005 to 0402 Chip : 30μm(3σ) ; IC : 15μm(3σ) |
