| Line | Brand | Model | Accuracy (Chip) | Hourly capacity |
|---|---|---|---|---|
| 1 | Hitachi/Yamaha | Σ-G5S+Σ-G5+ YVL88II | 01005 (0.4mm ×0.2 mm) | 123,000 Chip |
| 2 | Hitachi/Yamaha | Σ-G5+ YV100II | 01005 (0.4mm ×0.2 mm) | 74,000 Chip |
| 3 | Yamaha | YV100XG | 0201 (0.6mm ×0.3 mm) | 12,000 Chip |
The three flexible lines of SMD capacity configuration that best suits customers’ specified product component number or precision.
All lines are equipped with an EKRA automatic printer to improve the process yield.
Three units of TRI AO products all undergo AOI testing to improve the product yield.
Whole area is entirely protected by static electricity to ensure products are free from static electricity damage.
LINE 1 : board unloader→board loader→automatic printer→CCD solder paste inspection machine→ high speed machine→high speed machine→multi-function mounter→reflow oven in area 20→board stacker→AOI
LINE 2 : board unloader→board loader→automatic printer→CCD solder paste inspection machine→ high speed machine→medium speed machine→reflow oven in area 20→board stacker→AOI
LINE 3 : board unloader→board loader→automatic printer→CCD solder paste inspection machine→medium speed machine→reflow oven in area 16→AOI
LINE1 Process Capabilities
| Stencil Size Range | L 650 mm × W 550 mm |
| Min. IC Pitch | 0.30 mm |
| Max. PCB Size | L 500 mm × W 250 mm |
| Min. Chip Size | 01005(0.4mm ×0.2 mm) |
| Max. Comp. Size | 72 mm × 72 mm Connector : 150mm x 26mm |
| Min. BGA Ball Pitch | 0.80 mm (Min) |
| Min. BGA Ball Diameter | 0.40 mm (Min) |
| Min. QFP Lead Pitch | 0.38 mm (Min) |
| Frequency of Stencil Cleaning | 1 time / 10 ~ 20 Pieces |
| Accuracy for HITACHI Σ-G5S | 03015 to 0603 Chip : 30μm(3σ) ; IC : 15μm(3σ) |
| Accuracy for HITACHI Σ-G5 | 0201 / 01005 Chip : 40μm(3σ) ; IC : 30μm(3σ) |
| Accuracy for YVL88II | Within +/-0.08mm/chip ; +/-0.04mm/QFP |
LINE2 Process Capabilities
| Stencil Size Range | L 650 mm × W 550 mm |
| Min. IC Pitch | 0.30 mm |
| Max. PCB Size | L 610 mm × W 300 mm |
| Min. Chip Size | 01005(0.4mm ×0.2 mm) |
| Max. Comp. Size | 44 mm × 44 mm |
| Min. BGA Ball Pitch | 0.25 mm (Min) |
| Min. BGA Ball Diameter | 0.13 mm (Min) |
| Min. QFP Lead Pitch | 0.30 mm (Min) |
| Frequency of Stencil Cleaning | 1 time / 10 Pieces |
| Accuracy for HITACHI Σ-G5 | 0201 / 01005 Chip : 40μm(3σ) ; IC : 30μm(3σ) |
| Accuracy for YVL100II | Within +/-0.1mm/chip ; +/-0.08mm/QFP |
LINE3 Process Capabilities
| Stencil Size Range | L 650 mm × W 550 mm |
| Min. IC Pitch | 0.30 mm |
| Max. PCB Size | L460xW440mm |
| Min. Chip Size | 0201(0.6mm ×0.3 mm) |
| Max. Camera Size | 45 mm × 45 mm |
| Min. BGA Ball Pitch | 0.80 mm (Min) |
| Min. BGA Ball Diameter | 0.40 mm (Min) |
| Min. QFP Lead Pitch | 0.38 mm (Min) |
| Frequency of Stencil Cleaning | 1 time / 10 ~ 20 Pieces |
| Accuracy for YV100XG | Within (μ＋3σ）：+/-0.05mm/CHIP，+/-0.05mm/QFP |
