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SMT
DIP & TEST / REPAIR
Package / Assembly
Equipment
Conformal Coating
SMT
LineBrandModelAccuracy (Chip)Hourly capacity
1Hitachi/YamahaΣ-G5S+Σ-G5+ YVL88II01005
(0.4mm ×0.2 mm)
123,000 Chip
2Hitachi/YamahaΣ-G5+ YV100II01005
(0.4mm ×0.2 mm)
74,000 Chip
3YamahaYV100XG0201
(0.6mm ×0.3 mm)
12,000 Chip

The three flexible lines of SMD capacity configuration that best suits customers’ specified product component number or precision.
All lines are equipped with an EKRA automatic printer to improve the process yield.
Three units of TRI AO products all undergo AOI testing to improve the product yield.
Whole area is entirely protected by static electricity to ensure products are free from static electricity damage.

LINE 1 : board unloader→board loader→automatic printer→CCD solder paste inspection machine→ high speed machine→high speed machine→multi-function mounter→reflow oven in area 20→board stacker→AOI
LINE 2 : board unloader→board loader→automatic printer→CCD solder paste inspection machine→ high speed machine→medium speed machine→reflow oven in area 20→board stacker→AOI
LINE 3 : board unloader→board loader→automatic printer→CCD solder paste inspection machine→medium speed machine→reflow oven in area 16→AOI

LINE1 Process Capabilities

Stencil Size RangeL 650 mm × W 550 mm
Min. IC Pitch0.30 mm
Max. PCB SizeL 500 mm × W 250 mm
Min. Chip Size01005(0.4mm ×0.2 mm)
Max. Comp. Size72 mm × 72 mm
Connector : 150mm x 26mm
Min. BGA Ball Pitch0.80 mm (Min)
Min. BGA Ball Diameter0.40 mm (Min)
Min. QFP Lead Pitch0.38 mm (Min)
Frequency of Stencil Cleaning1 time / 10 ~ 20 Pieces
Accuracy for HITACHI Σ-G5S03015 to 0603 Chip : 30μm(3σ) ; IC : 15μm(3σ)
Accuracy for HITACHI Σ-G50201 / 01005 Chip : 40μm(3σ) ; IC : 30μm(3σ)
Accuracy for YVL88IIWithin +/-0.08mm/chip ; +/-0.04mm/QFP

LINE2 Process Capabilities

Stencil Size RangeL 650 mm × W 550 mm
Min. IC Pitch0.30 mm
Max. PCB SizeL 610 mm × W 300 mm
Min. Chip Size01005(0.4mm ×0.2 mm)
Max. Comp. Size44 mm × 44 mm
Min. BGA Ball Pitch0.25 mm (Min)
Min. BGA Ball Diameter0.13 mm (Min)
Min. QFP Lead Pitch0.30 mm (Min)
Frequency of Stencil Cleaning1 time / 10 Pieces
Accuracy for HITACHI Σ-G50201 / 01005 Chip : 40μm(3σ) ; IC : 30μm(3σ)
Accuracy for YVL100IIWithin +/-0.1mm/chip ; +/-0.08mm/QFP

LINE3 Process Capabilities

Stencil Size RangeL 650 mm × W 550 mm
Min. IC Pitch0.30 mm
Max. PCB SizeL460xW440mm
Min. Chip Size0201(0.6mm ×0.3 mm)
Max. Camera Size45 mm × 45 mm
Min. BGA Ball Pitch0.80 mm (Min)
Min. BGA Ball Diameter0.40 mm (Min)
Min. QFP Lead Pitch0.38 mm (Min)
Frequency of Stencil Cleaning1 time / 10 ~ 20 Pieces
Accuracy for YV100XGWithin (μ+3σ):+/-0.05mm/CHIP,+/-0.05mm/QFP
DIP & TEST / REPAIR

DIP Lead-free Line:

  • Flexible deployment of the number of operators according to customers’ demand.
  • Switchable disposable processes and washing processes
  • Double-sided processes for PCB boards with thicknesses 2.5mm~3.5mm.
  • System burn-in room with a capacity of 200pcs.

Processes and Equipment:

Through-hole wave soldering: Maximun width 350mm. Cleaning/no-clean flux process

BGA 維修站:

Equipment model : Fine-Tech Electronics BGA 936USB

BGA Parts Repair and Replacement

 ICT Test Station:

Equipment model :TRI Innovation TR-518FR

Electronic board processes OPEN/SHORT and defective parts testing.

Package / Assembly

System Assembly Line:

Flexible deployment of the number of operators according to customers’ demand.

Processes and Equipment:

Equipment

QC Equipment

MachineBrandBodelQtyRemarks
Solder paste thickness measurement machineAscentexASM-II1Measurement of older thickness
AOI(Desk-top)TRI InnovationTR7700L SIII DT2Automated optical product inspection
AOI(Desk-top)TRI InnovationTR-7530DT1Automated optical product inspection
BGA 維修機弘騰BGA 936USB1BGA拆焊
Constant Temperature and humidity testing machineGiant Force InstrumentCTH-408-40-CP-AR2Component and product reliability test and analysis
Static grounding monitoring alarmFortune TellFT-038B1Whole-plant static line monitoring (8 ports)
3D 300X顯微放大鏡和創YQ-300(USB CCD)1IQC檢驗
3D 300X顯微放大鏡和創YQ-300(hdmi)1不良分析
3眼 50X顯微放大鏡明治EMZ-51檢驗、焊接、分析
3眼 50X顯微放大鏡MOTICSMZ-1716檢驗、焊接、分析
鋼板清洗機OKIACT-1001鋼板清洗

Equipment list

機器廠牌型號數量備註
鋼板清洗機OKIACT-1001
半自動印刷機德佳精密DFR-3040 C21
錫膏測厚機技高ASM-II1
全自動印刷機EKRAXPRT 51
全自動印刷機EKRAE41
全自動印刷機GTACc1
高速著裝機HITACHIΣ-G5S1
高速著裝機HITACHIΣ-G51外加托盤台車
中速著裝機YAMAHAYV 100 II 3
中速著裝機YAMAHAYV 100XG1
泛用著裝機YAMAHAYVL 88 II1
回焊爐圓星(皇迪)YX-LFHACRF220區
回焊爐圓星(皇迪)HD-NAACRF116區
X-RAY島津SHIMADZAMX-1000 PLUS1
AOI德律TR7700L SIII DT 2外加檢修站
AOI德律TR-7530DT1外加檢修站
ICT德律TR-518FR3含Test Jet
飛針測試機TAKAYAAPT-8400CJ1
無鉛錫爐吉電JT-620L1免洗/水洗雙面製程
W:350mm
純水造水機尚磊A2B2T-21純水製造
PCB水洗機信威SU-560-II1純水洗製程
BGA 維修機弘騰BGA 936USB1BGA 維修
自動塗覆機PVAPVA-60002PCB Size:500*500mm
塗覆範圍:400*320mm
XYZ ROBOT 瞬利SD-4003程式化點膠作業,可加裝各式針頭,適用各類型膠的塗佈
IR Reflow圓星YX-H25001三防膠表乾用L:2.5M
手動噴槍噴膠室圓星訂製規格1手動噴膠用
Conformal Coating

Conformal Coating Process

  • Professional conformal coating line
  • Variety of coating materials to choose from (Acrylic, silicon etc.)
  • Variety of coating processes (Dipping, spraying, by hand or by automatic machine)

流程和設備:

(+886)-2-2901-4625
(+886)-2-2906-1985

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